Center for Co-design of Chip, Package, System

The Center for Co-design of Chip, Package, System conducts leading-edge research in the following areas:
   • System Architecture, Planning, Modeling and Implementation
   • IC Floor Planning, Place & Route, Design, Modeling and Characterization
   • Advanced Packaging, Substrate Fabrication, Modeling and Characterization
   • Advanced Interconnect and 3D Integration Technologies
   • Electronic Design Automation that includes Physical CAD and Multi-physics Modeling
   • Emerging Device and Interconnect Technologies

The center is organized into program specific areas where a group of faculty with complimentary expertise work on application driven technologies. An overview of the programs can be found on our research page.

Congratulations to Muhannad Bakir

Congratulations to Muhannad Bakir 

Congratulations to Muhannad Bakir and his colleague Sam Sober at the Department of Biology at Emory University on receiving a McKnight Technological Innovation in Neuroscience Award. This marks the first time that Georgia Tech has received this prestigious honor. Out of 112 submissions, their project was one of three awarded by the McKnight Foundation. Each of the projects recognized in the program will be aimed at developing groundbreaking technologies to map, monitor, and model brain function. 
 
The title of Muhannad's and Sam’s project is “Flexible electrode arrays for large-scale recordings of spikes from muscle fibers in freely behaving mice and songbirds.” They are developing a high definition sensor array that allows researchers to detect and record very precise electrical signals from individual muscle fibers. To date, this information has been gathered by inserting wires into muscles that can only detect the summed activity of many individual signals that the nervous system uses to control muscles. The proposed approach has many electrode arrays that record from a muscle without damaging it. Prior approaches relied on wires that could damage muscles when inserted, especially small muscles used in fine motor skills. The arrays are fabricated from flexible materials that fit the shape of a muscle and change shape as the animal moves. Because the arrays collect exponentially more data than prior devices, they have built-in 3D stacked circuits to collect and serialize the data before transmitting the signals to the researcher’s computer; to enable such compact and very dense electrode arrays, 3D IC technology, advanced microelectronic packaging, and flexible electronic technologies are all utilized and co-integrated.   
 
A previous prototype version of the array has already revealed new insights. Previously, it was believed that the nervous system controls muscle activity by regulating only the total number of electrical spikes sent to a muscle. But precise detection done by the Emory team revealed that millisecond-level variations in multi-spike timing patterns change how muscles control behavior. The new arrays will be designed for use in mice and songbirds and will help the team understand the neural control of many different skilled behaviors and potentially provide new insights into neurological disorders that affect motor control.