Center for Co-design of Chip, Package, System

The Center for Co-design of Chip, Package, System conducts leading-edge research in the following areas:
   • System Architecture, Planning, Modeling and Implementation
   • IC Floor Planning, Place & Route, Design, Modeling and Characterization
   • Advanced Packaging, Substrate Fabrication, Modeling and Characterization
   • Advanced Interconnect and 3D Integration Technologies
   • Electronic Design Automation that includes Physical CAD and Multi-physics Modeling
   • Emerging Device and Interconnect Technologies

The center is organized into program specific areas where a group of faculty with complimentary expertise work on application driven technologies. An overview of the programs can be found on our research page.